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Upcoming SMAC Shows and Events
Affidabilitá e Tecnologie
MaGyc
4/14 - 4/15, 2010
Turin, Italy
2010 Precision Optics Expo
SMMC
6/9 - 6/11, 2010
Taipei, Taiwan
Display Taiwan 2010
Servo Taiwan
6/9 - 6/11, 2010
Taipei, Taiwan
Automation Industrial Exhibition
Festek
8/4 - 8/7, 2010
Taipei, Taiwan
IMTS 2010
SMAC
9/13 - 9/18, 2010
Chicago, Illinois
TPCA Taiwan
SMMC
10/21 - 10/23, 2010
Taipei, Taiwan
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Electronic Applications, Pick & Place, IC Chip Handling, Continuity
Electronic Applications
SMAC's patented Soft-Land routine within the actuator allows the rod or gripper jaw to approach at high speed and then land on the surface of a component with a low programmable force. This unique feature is extremely useful whenever delicate or high value components are being handled.
The SMAC actuators are compact, lightweight, extremely fast and accurate, offering a combination of force, position and velocity control in both the linear and rotary axis at the same time. They also offer the option of a vacuum pick-up facility. This makes the actuators ideal for the switch testing of a variety of applications such as mobile phones, PDAs, touch screens and the insertion and inspection of ICs, to name just a few.
Die Bonding
Die bonding requires precise and gentle placement, followed by a specific amount of force in order to assure an accurate bond. SMAC actuators were used in such an application.
The units supplied combine independent programmable linear and rotary motions along with SMAC's unique programmable force capability. This enables the actuators to softly land on a surface and then apply a precise programmed force. All this, along with a vacuum pick-up capability, is incorporated in a robust ready-to-mount unit. The die bonding application uses the electronic actuator by moving it to the pick up position, then landing softly on an unknown datum surface without impact or damage, with a controlled force of less than 10gf. The wafer is then picked up and moved to enable checking of the distorted angle by a camera vision system. If any further movement is required to compensate for the distorted angle, the rotary motor within the system is used. The SMAC actuator then moves the wafer to the bonding position and places it into a tray, once again using the unique SMAC Soft-Land function. Bonding is executed in accordance of the wafer size using 3kg, 3.5kg or 4kg force dependent on the exact requirement using programmable force mode with a force range from 0.1N to 40N. One cycle is completed in only 2.2 seconds.
The SMAC Moving Coil Actuator (MCA) is ideal for such applications, as the linear force is freely and totally programmable, enabling bonding for different dies. In addition, the camera orientation can be performed with exceptional precision because of the high-quality rotary encoder within the system. The overall compact size (62mm x 85mm x 45mm) and low height of the SMAC unit is designed to accommodate the top interference of the camera. The pick-up function is accommodated by the built-in vacuum system via the hollow through shaft of the actuator.
Typical Die Bonding Technical Specifications
- Linear maximum force: 45N
- Linear encoder resolution: One micron
- Rotary encoder resolution: 19,456 CPR
- Total mass: 1.1kg force
Button Testing
SMAC actuators are ideal for a wide variety of button and switch testing applications. The stroke and force required to make or break contact can be measured. The Soft-Land feature allows testing to be done without the risk of damaging delicate mechanisms, and testing can be done in-line during the manufacturing process.
- Cell phone keypads
- PC keyboards
- Membrane keypads
- Valves, sensors and relays
- ATM keypads
- Seat belt buttons
- Piano keyboards
Switch Testing
- Light switches
- Audio switches
- Cruise control switches
- Car navigation systems
- Trunk release switches
- Kitchen appliances
- Car horn switches
SMAC Advantages
- Stroke, to make or break contact
- Force, to actuate switch
- Spring constant
- Lifetime cycling
- High speed, long life design for continuous operation
- Linear/rotary actuator in a single ready-to-mount package
- Ability to land softly onto delicate and low-force microswitches with a force of only a few grams
- Force feedback allows the user to measure the break/toggle point on the out and return stroke, displaying switch differential hysteresis effect
- Easily programmed position and force "windows" to warn of missing or broken components
- Life testing of components as well as measurement and QA reporting functions in one unit
- Assembly and test functions in one unit
- Data capture to plot force vs. position
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